Semiconductor device and method for manufacturing the same

ABSTRACT

A device includes an epitaxy structure having a recess therein, a dielectric layer over the epitaxy structure, the dielectric layer having a contact hole communicating with the recess, a dielectric spacer liner (DSL) layer on a sidewall of the recess, a barrier layer on the DSL layer, and a conductor. The DSL layer has an opening. The DSL layer extends further into the epitaxy structure than the barrier layer. The conductor is disposed in the contact hole and electrically connected to the epitaxy feature through the opening of the DSL layer.

PRIORITY CLAIM AND CROSS-REFERENCE

The present application is a divisional application of the U.S.application Ser. No. 14/842,680, filed Sep. 1, 2015, now U.S. Pat. No.9,947,753, issued on Apr. 17, 2018 which claims priority to U.S.Provisional Application Ser. No. 62/162,388, filed May 15, 2015, whichare herein incorporated by reference in their entireties.

BACKGROUND

The present disclosure relates to semiconductor devices.

The scaling of integrated circuits is a constant effort. With circuitsbecoming smaller and faster, metal silicide contacts are often used toobtain higher circuit performance. Since the metal silicide contactshave lower contact resistance than non-silicided regions, integratedcircuits using this technology can have smaller contact areas, and useless energy to pass electricity through them. Together, these effectslead to higher-performance integrated circuits.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-15 are cross-sectional views of intermediate stages in formationof a metal-oxide-semiconductor (MOS) device in accordance with someexemplary embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

A metal-oxide-semiconductor (MOS) device and a method for manufacturingthe same are provided in accordance with various exemplary embodiments.The intermediate stages of forming the MOS device are illustrated. Thevariations of the embodiments are discussed. Throughout the variousviews and illustrative embodiments, like reference numbers are used todesignate like elements.

FIGS. 1-15 are cross-sectional views of intermediate stages in formationof a metal-oxide-semiconductor (MOS) device 100 in accordance with someexemplary embodiments. Reference is made to FIG. 1. A wafer, whichincludes a semiconductor substrate 110, is provided. The semiconductorsubstrate 110 may be made of a semiconductor material, such as silicon,silicon carbide (SiC), silicon germanium (SiGe), an III-V compoundsemiconductor, or combinations thereof. Isolation regions, such asshallow trench isolation (STI) regions 200, are formed in thesemiconductor substrate 110 and are used to define the active region ofthe MOS device 100.

A gate stack 120 is formed over the semiconductor substrate 110. Thegate stack 120 includes a dummy gate dielectric 122 and a dummy gateelectrode 124. The dummy gate dielectric 122 includes silicon oxide insome exemplary embodiments. In alternative embodiments, other materials,such as silicon nitride, silicon carbide (SiC), and the like, are alsoused. The dummy gate electrode 124 may include polysilicon. In someembodiments, the gate stack 120 further includes a hard mask 126 overthe dummy gate electrode 124. The hard mask 126 may include siliconnitride, for example, while other materials, such as silicon carbide(SiC), silicon oxynitride, and the like, may also be used. Inalternative embodiments, the hard mask 126 is not formed.

Lightly-doped drain/source (LDD) regions 130 are formed, for example, byimplanting a p-type impurity (such as boron and/or indium) or an n-typeimpurity (such as phosphorous and/or arsenic) into the semiconductorsubstrate 110, depending on the conductivity type of the resultingmetal-oxide-semiconductor (MOS) device 100. For example, when the MOSdevice 100 is a pMOS device, the LDD regions 130 are p-type regions.When the MOS device 100 is an nMOS device, the LDD regions 130 aren-type regions. The gate stack 120 acts as an implantation mask, so thatthe edges of the LDD regions 130 are substantially aligned with theedges of the gate stacks 120.

Reference is made to FIG. 2. Gate spacers 140 are formed on sidewalls ofthe gate stack 120. In some embodiments, each of the gate spacers 140includes a silicon oxynitride layer 142 and a silicon oxide layer 144.In alternative embodiments, the gate spacers 140 include one or morelayers, each including silicon oxide, silicon nitride, siliconoxynitride, or other dielectric materials. The available formationmethods include plasma enhanced chemical vapor deposition (PECVD),low-pressure chemical vapor deposition (LPCVD), sub-atmospheric chemicalvapor deposition (SACVD), and other deposition methods.

Source and drain regions (referred to as source/drain regionshereinafter) 135 are formed in the semiconductor substrate 110. In theembodiments wherein the metal-oxide-semiconductor (MOS) device 100 is apMOS device, the source/drain regions 135 are of p-type. In theembodiments wherein the MOS device 100 is an nMOS device, thesource/drain regions 135 are of n-type. In some embodiments,source/drain stressors (also marked as 135) are formed in thesemiconductor substrate 110. The source/drain stressors form at leastparts of the source/drain regions 135. FIG. 2 illustrates theembodiments in which the source/drain regions 135 fully overlap therespective source/drain stressors. In alternative embodiments, thesource/drain regions 135 and the source/drain stressors are partiallyoverlapped.

Furthermore, in the embodiments in which the metal-oxide-semiconductor(MOS) device 100 is an nMOS device, the source/drain stressors 135 mayinclude silicon phosphorous (SiP), silicon carbide (SiC), or the like.In the embodiments in which the MOS device 100 is a pMOS device, thesource/drain stressors 135 may include silicon germanium (SiGe). Theformation of the source/drain stressors 135 may be achieved by etchingthe semiconductor substrate 110 to form recesses therein and thenperforming an epitaxy to grow the source/drain stressors 135 in therecesses.

Reference is made to FIG. 3. A contact etch stop layer (CESL) 150 isformed over the gate stack 120 and the source/drain regions 135. In someembodiments, the CESL 150 includes silicon nitride, silicon carbide(SiC), or other dielectric materials. An inter-layer dielectric (ILD)160 is form over the CESL 150. The ILD 160 is blanket formed to a heighthigher than a top surface of the gate stack 120. The ILD 160 may includeflowable oxide formed using, for example, flowable chemical vapordeposition (FCVD). The ILD 160 may also be a spin-on glass formed usingspin-on coating. For example, the ILD 160 may include phospho-silicateglass (PSG), boro-silicate glass (BSG), boron-doped phospho-silicateglass (BPSG), tetraethyl orthosilicate (TEOS) oxide, TiN, SiOC, or otherlow-k non-porous dielectric materials.

FIG. 4 illustrates a planarization step, which is performed using, forexample, chemical mechanical polish (CMP). The CMP is performed toremove excess portions of the inter-layer dielectric (ILD) 160 and thecontact etch stop layer (CESL) 150, wherein the excess portions are overthe top surface of the hard mask 126. Accordingly, the gate stack 120 isexposed. In alternative embodiments, the hard mask 126 is removed duringthe CMP, wherein the CMP stops on the top surface of the dummy gateelectrode 124.

Reference is made to FIG. 5. The hard mask 126, the dummy gate electrode124, and the dummy gate dielectric 122 are removed. An opening O isformed as a result of the removal of the hard mask 126, the dummy gateelectrode 124, and the dummy gate dielectric 122. In some embodiment,the width W1 of the opening O is smaller than about 25 nm and may be ina range from about 18 nm to about 22 nm. It is appreciated, however,that the values recited throughout the description are merely examplesand may be changed to different values. Furthermore, the depth D1 of theopening O may be greater than about 40 nm. The aspect ratio D1/W1 of theopening O may be higher than about 1.3, higher than about 7, or higherthan about 10.

Reference is FIG. 6. A gate dielectric layer 121 is formed. In someembodiments, the gate dielectric layer 121 includes an interfacial layer(IL, the lower part of the gate dielectric layer 121), which is adielectric layer. In some embodiments, the IL includes an oxide layer,such as a silicon oxide layer, which may be formed through a thermaloxidation of the semiconductor substrate 110, a chemical oxidation, or adeposition step. The gate dielectric layer 121 may also include a high-kdielectric layer (the upper part of the gate dielectric layer 121)including a high-k dielectric material, such as hafnium oxide, lanthanumoxide, aluminum oxide, or combinations thereof. The dielectric constant(k-value) of the high-k dielectric material is higher than about 3.9,and may be higher than about 7, and sometimes as high as about 21 orhigher. The high-k dielectric layer is overlying, and may contact, theIL.

As shown in FIG. 6, a diffusion barrier layer 123 is formed over thegate dielectric layer 121. In some embodiments, the diffusion barrierlayer 123 includes TiN, TaN, or combinations thereof. For example, thediffusion barrier layer 123 may include a TiN layer (the lower part ofthe diffusion barrier layer 123), and a TaN layer (the upper part of thediffusion barrier layer 123) over the TiN layer. The TiN layer may havea thickness lower than about 65 A, and the TaN layer may have athickness lower than about 20 A.

A metal layer 125 is formed over the diffusion barrier layer 123. In theembodiments in which the resulting metal-oxide-semiconductor (MOS)device 100 is an nMOS device, the metal layer 125 is in contact with thediffusion barrier layer 123. For example, in the embodiments in whichthe diffusion barrier layer 123 includes a TiN layer and a TaN layer,the metal layer 125 may be in physical contact with the TaN layer. Inalternative embodiments in which the resulting MOS device 100 is a pMOSdevice, an additional TiN layer (not shown) is formed between, and incontact with, the TaN layer (in the diffusion barrier layer 123) and theoverlaying metal layer 125. The additional TiN layer provides the workfunction suitable for the pMOS device, which work function is higherthan the mid-gap work function (about 4.5 eV) that is in the middle ofthe valance band and the conduction band of silicon. The work functionhigher than the mid-gap work function is referred to as a p-workfunction, and the respective metal having the p-work function isreferred to as a p-metal.

The metal layer 125 provides the work function suitable for the nMOSdevice, which work function is lower than the mid-gap work function. Thework function lower than the mid-gap work function is referred to as ann-work function, and the respective metal having the n-work function maybe referred to as an n-metal. In some embodiments, the metal layer 125is an n-metal having a work function lower than about 4.3 eV. The workfunction of the metal layer 125 may also be in a range from about 3.8 eVto about 4.6 eV. The metal layer 125 may include titanium aluminum(TiAl) (which may include, or free from or substantially free from otherelements) in accordance with some embodiments. The formation of themetal layer 125 may be achieved through physical vapor deposition (PVD).In accordance with some embodiments of the present disclosure, the metallayer 125 is formed at room temperature (for example, from about 20 ° C.to about 25 ° C.). In alternative embodiments, the metal layer 125 isformed at an elevated temperature higher than the room temperature, forexample, higher than about 200 ° C.

A block layer 127 is formed over the metal layer 125. The block layer127 may include TiN in some embodiments. The block layer 127 may beformed using atomic layer deposition (ALD). In some embodiments, theblock layer 127 has a thickness in a range from about 2 nm to about 7nm.

A wetting layer 128 which has an ability to adhere (and wet) thesubsequently formed filling metal 129 during the reflow of the fillingmetal 129 is formed over the block layer 127. In some embodiments, thewetting layer 128 is a cobalt layer, which may be formed using atomiclayer deposition (ALD) or chemical vapor deposition (CVD). In someembodiments, the wetting layer 128 has a thickness in a range from about1 nm to about 3 nm.

Filling metal 129 is formed to fill the remaining portion of the openingO (as shown in FIG. 5). The filling metal 129 may include aluminum or analuminum alloy, which may also be formed using physical vapor deposition(PVD), chemical vapor deposition (CVD), or the like. The filling metal129 may be reflowed to fully fill the remaining opening O as in FIG. 5.The formation of the wetting layer 128 improves the wetting of thefilling metal 129 to the underlying layers.

FIG. 7 illustrates a planarization step (for example, chemicalmechanical polish (CMP)) for removing excess portions of the layers 129,128, 127, 125, 123, and 121, wherein the excess portions are over theinter-layer dielectric (ILD) 160. The remaining portions of the layers129, 128, 127, 125, 123, and 121 form a replacement metal-containinggate stack. Each of the remaining portions of the layers 129, 128, 127,125, 123, and 121 may include a bottom portion and sidewall portionsover and connected to the bottom portion.

Reference is made to FIG. 8. An oxide film 170 is formed on theinter-layer dielectric (ILD) 160 and the gate stack 120, in accordancewith some embodiments. The oxide film 170 is a continuous film. Theoxide film 170 may cover or be in direct contact with the ILD 160 andthe gate stack 120. The oxide film 170 is made of, for example, siliconoxide, aluminum oxide, or other oxide-containing materials suitable toadhere to the ILD 160 and the subsequently formed layer. The oxide film170 may have a thickness in a range from about 10 A to about 30 A. Theoxide film 170 may be formed using, for example, chemical vapordeposition (CVD).

A contact etch stop layer (CESL) 175 is formed over the inter-layerdielectric (ILD) 160 and the gate stack 120 in accordance with someembodiments. The CESL 175 may be formed on the oxide film 170. The CESL175 is made of silicon nitride or other suitable materials.

Embodiments of the disclosure have many variations. For example, inalternative embodiments, the oxide film 170 is not formed. The gatestack 120 is in direct contact with the contact etch stop layer (CESL)175.

A protective layer 180 is formed on the contact etch stop layer (CESL)175. The protective layer 180 is configured to protect the CESL 175 frombeing damaged during a subsequent pre-amorphized implantation (PAI)process, in accordance with some embodiments. The protective layer 180includes, for example, a plasma-enhanced oxide (PEOX) layer.

Reference is made to FIG. 9. The protective layer 180, the contact etchstop layer (CESL) 175, the oxide film 170, the inter-layer dielectric(ILD) 160, and the contact etch stop layer (CESL) 150 may be patternedto form contact holes C exposing the source/drain regions 135,respectively. A photolithography process and an etching process may beused for patterning. For example, a photoresist etch mask can beproduced by applying a photoresist layer to the upper surface of theprotective layer 180, exposing the photoresist layer to a pattern ofradiation, and then developing the pattern into the photoresist etchmask utilizing a resist developer. The photoresist etch mask may bepositioned so that portions of the protective layer 180, the CESL 175,the oxide film 170, the ILD 160, and the CESL 150 are not protected bythe photoresist etch mask in order to provide the contact holes C.

The exposed portions of the protective layer 180, the contact etch stoplayer (CESL) 175, the oxide film 170, the inter-layer dielectric (ILD)160, and the contact etch stop layer (CESL) 150 are then removed to formthe contact holes C. In some embodiments, portions of the source/drainregions 135 are removed as well to form recesses R respectively in thesource/drain regions 135. The recesses R respectively communicate withthe contact holes C.

In some embodiments, the contact holes C and the recesses R are formedusing a combination of dry etching and wet etching. Specifically, theexposed portions of the protective layer 180, the contact etch stoplayer (CESL) 175, the oxide film 170, the inter-layer dielectric (ILD)160, and the contact etch stop layer (CESL) 150 may be removed to formthe contact holes C using dry etching, such as reactive ion etching(RIE). Then, portions of the source/drain regions 135 may be removed toform the recesses R using wet etching.

After the recesses R are formed, oxide may be formed on sidewalls S andbottom surfaces B of the recesses R. The oxide is a by-product of theetching for forming the recesses R and has a thickness lower than about15 A. The oxide on at least the sidewalls S of the recesses R is removedor cleaned physically. In some embodiments, the oxide on the sidewalls Sof the recesses R is removed using spattering with an inert gas, such asargon spattering. In some embodiments, the oxide on the bottom surfacesB of the recesses R is also removed or cleaned by the spattering.

Reference is made to FIG. 10. A dielectric spacer liner (DSL) layer 190is conformally formed on the protective layer 180, sidewalls of thecontact holes C, and the sidewalls S and the bottom surfaces B of therecesses R in accordance with some embodiments. The DSL layer 190 isconfigured to protect the sidewalls of the contact holes C from beingdamaged by the subsequent pre-amorphized implantation (PAI) process. TheDSL layer 190 is made of, for example, silicon oxycarbide (SiOC),silicon oxynitride (SiON), silicon dioxide (SiO₂), silicon nitride(SiN), other suitable materials, or combinations thereof. The DSL layer190 is formed by, for example, atomic layer deposition (ALD) or othersuitable processes.

In some embodiments, the dielectric spacer liner (DSL) layer 190 is aconformally deposited layer. The term “conformally deposited layer”denotes a layer having a thickness that does not deviate from greaterthan or less than 20% of an average value for the thickness of thelayer.

Since the oxide on the sidewalls S of the recesses R is removed orcleaned physically, the dielectric spacer liner (DSL) layer 190 can beformed on the sidewalls S of the recesses R. The DSL layer 190 on thesidewalls S of the recesses R is configured to prevent an etchant usedin the subsequent process from getting through the DSL layer 190, thesource/drain regions 135, the gate spacers 140, and/or the semiconductorsubstrate 110 to damage the gate stack 120.

Reference is made to FIG. 11. An etching process is performed to removethe dielectric spacer liner (DSL) layer 190 on the bottom surfaces B ofthe recesses R so as to expose portions of the source/drain regions 135.The etching process includes, for example, an argon plasma etchingprocess.

Afterwards, a cleaning process may be performed to clean the residuesfrom the etching process of the dielectric spacer liner (DSL) layer 190on the bottom surfaces B of the recesses R. The cleaning processincludes, for example, an ammonia hydroxide-hydrogen peroxide-watermixture (APM) cleaning process using a cleaning solution containingNH₄OH, H₂O₂, and H₂O.

A pre-amorphized implantation (PAI) process may be performed to reducethe dopant channeling effect and enhance dopant activation. In someembodiments, silicon, germanium, or carbon is used. In alternativeembodiments, inert gases, such as neon, argon, krypton, xenon, and/orradon, are used. The PAI process prevents subsequently doped impuritiesfrom channeling through spaces within the crystal lattice structure andreaching depths greater than desired. Portions of the source/drainregions 135 exposed and located at the bottom surfaces B of the recessesR are turned into an amorphous state as a result of the PAI process.

Reference is made to FIG. 12. A metal containing material 137 is formedon the recesses R. The metal containing material 137 may be deposited onthe dielectric spacer liner (DSL) layer 190 and the bottom surfaces B ofthe recesses R. In some embodiments, the metal containing material 137is a conformally deposited layer. In alternative embodiments, the metalcontaining material 137 fills the recesses R.

The metal containing material 137 may be deposited using physical vapordeposition (PVD) or chemical vapor deposition (CVD). Examples of PVDthat are suitable for forming the metal containing material 137 includesputtering and plating. In some embodiments, the metal containingmaterial 137 may include nickel or nickel platinum alloy. In alternativeembodiments, the metal containing material 137 may include cobalt, (Co),tungsten (W), titanium (Ti), tantalum (Ta), aluminum (Al), platinum(Pt), ytterbium (Yb), molybdenum (Mo), erbium (Er), or combinationsthereof. The metal containing material 137 may have a thickness in arange from about 5 nm to about 20 nm. In alternative embodiments, themetal containing material 137 may have a thickness in a range from about6 nm to about 15 nm.

Reference is made to FIG. 13. Following deposition of the metalcontaining material 137, the structure is subjected to an annealing stepincluding, but not limited to, rapid thermal annealing (RTA). During theannealing step, the deposited metal containing material 137 reacts withportions of the source/drain regions 135 adjacent to the recesses Rforming metal semiconductor alloy contacts 139, such as a metalsilicide. In some embodiments, the annealing step is performed at atemperature ranging from about 350 ° C. to about 600 ° C. for a timeperiod ranging from about 1 second to about 90 seconds.

Following the annealing step, the remaining metal containing material137 that is not converted to the metal semiconductor alloy contacts 139(referred to as non-reacted metal containing material hereinafter) isremoved. The non-reacted metal containing material may be removed by anetching process that is selective to the metal semiconductor alloycontacts 139. The etching process may include wet etching, dry etching,or combinations thereof. In some embodiments, the non-reacted metalcontaining material is removed by wet etching. An etchant, such as hotphosphoric acid, is chosen to remove the non-reacted metal containingmaterial.

Since the dielectric spacer liner (DSL) layer 190 is formed on thesidewalls S of the recesses R, and the DSL layer 190 is made of amaterial which can prevent the etchant used in the wet etching of thenon-reacted metal containing material from getting through. Therefore,the etchant is blocked from getting through the DSL layer 190, thesource/drain regions 135, the gate spacers 140, and/or the semiconductorsubstrate 110 to damage the gate stack 120.

Reference is made of FIG. 14. A barrier layer 197 is formed on thedielectric spacer liner (DSL) layer 190 and the metal semiconductoralloy contacts 139. The barrier layer 197 is made of a material whichcan adhere a conductor in the contact hole C to the DSL layer 190 andstop diffusion of the conductor into the DSL layer 190. In someembodiments, when the conductor in the contact hole C is made oftungsten (W), the barrier layer 197 is made of, for example, titaniumnitride (TiN), titanium (Ti)/TiN, Ti, or other transition metal basedmaterials, or combinations thereof. The barrier layer 197 is formed by,for example, physical vapor deposition (PVD), ionized physical vapordeposition (IPVD), atomic layer deposition (ALD), chemical vapordeposition (CVD), or combinations thereof.

A conductor 199 overfills the contact hole C. The conductor 199 is madeof metal, such as tungsten (W) or other suitable conductive materials.The conductor 199 is form by, for example, electrochemical deposition,physical vapor deposition (PVD), chemical vapor deposition (CVD), orcombinations thereof.

FIG. 15 illustrates a planarization step, which is performed using, forexample, chemical mechanical polish (CMP). The CMP is performed toremove the conductor 199, the barrier layer 197, and the DSL layer 190outside the contact holes C and over the top surface of the protectivelayer 180. After the CMP, the conductor 199 and the barrier layer 197remaining in the contact holes C forms contact plugs electricallyconnected to the metal semiconductor alloy contacts 139 and thesource/drain regions 135.

It is understood that for the embodiments shown above, additionalprocesses may be performed to complete the fabrication of asemiconductor device. For example, these additional processes mayinclude formation of interconnect structures (e.g., lines and vias,metal layers, and interlayer dielectric that provide electricalinterconnection to the semiconductor device), formation of passivationlayers, and packaging of the semiconductor device.

Embodiments of semiconductor devices described above remove oxide on thesidewalls S of the recesses R before formation of the dielectric spacerliner (DSL) layer 190. Therefore, the DSL layer 190 can be formed on thesidewalls S of the recesses R. The DSL layer 190 may be made of amaterial which can prevent an etchant used in the subsequent wet etchingof the non-reacted metal containing material from getting through.Therefore, during the wet etching of the non-reacted metal containingmaterial, the etchant is blocked from getting through the DSL layer 190,the source/drain regions 135, the gate spacers 140, and/or thesemiconductor substrate 110 to damage the gate stack 120.

In accordance with some embodiments of the present disclosure, a deviceincludes an epitaxy structure having a recess therein, a dielectriclayer over the epitaxy structure, the dielectric layer having a contacthole communicating with the recess, a dielectric spacer liner (DSL)layer on a sidewall of the recess, a barrier layer on the DSL layer, anda conductor. The DSL layer has an opening. The DSL layer extends furtherinto the epitaxy structure than the barrier layer. The conductor isdisposed in the contact hole and electrically connected to the epitaxyfeature through the opening of the DSL layer.

In accordance with alternative embodiments of the present disclosure, adevice includes an epitaxy structure, a dielectric layer over theepitaxy structure, a contact etch stop layer in between the dielectriclayer and the epitaxy structure, a conductor in the dielectric layer andthe contact etch stop layer and electrically connected to the epitaxystructure, and a dielectric spacer liner (DSL) layer around theconductor. The DSL layer extends over an interface between the contactetch stop layer and the epitaxy structure into the epitaxy structure.

In accordance with yet alternative embodiments of the presentdisclosure, a method depositing a dielectric layer over a source/drainstressor, a contact hole is etched and extends through the dielectriclayer and into the source/drain stressor, in which an oxide is formed ona surface of the source/drain stressor exposed by the contact hole afteretching the contact hole. The oxide on the surface of the source/drainstressor is removed. A dielectric spacer liner (DSL) layer is formed ona sidewall of the contact hole, and the contact hole is filled with aconductive material.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device, comprising: an epitaxy structure havinga recess therein; a dielectric layer over the epitaxy structure, thedielectric layer having a contact hole communicating with the recess; adielectric spacer liner (DSL) layer on a sidewall of the recess, whereinthe DSL layer has an opening; a barrier layer on the DSL layer, whereinthe DSL layer extends further into the epitaxy structure than thebarrier layer; and a conductor in the contact hole and electricallyconnected to the epitaxy structure through the opening of the DSL layer.2. The device of claim 1, wherein the DSL layer is further on a sidewallof the contact hole.
 3. The device of claim 1, further comprising: analloy contact in the epitaxy structure and under the conductor.
 4. Thedevice of claim 3, wherein a first interface between a bottom of the DSLlayer and the alloy contact is lower than a second interface between thebarrier layer and the alloy contact.
 5. The device of claim 1, whereinthe barrier layer is in between the DSL layer and the conductor.
 6. Thedevice of claim 1, further comprising: a contact etch stop layer overthe epitaxy structure, wherein the DSL layer is in contact with thecontact etch stop layer.
 7. A device, comprising: an epitaxy structure;a dielectric layer over the epitaxy structure; a contact etch stop layerin between the dielectric layer and the epitaxy structure; a conductorthrough the dielectric layer and the contact etch stop layer andelectrically connected to the epitaxy structure; and a dielectric spacerliner (DSL) layer around the conductor, wherein the DSL layer extendsover an interface between the contact etch stop layer and the epitaxystructure into the epitaxy structure.
 8. The device of claim 7, furthercomprising: an alloy contact in the epitaxy structure and under theconductor.
 9. The device of claim 8, further comprising: a barrier layerwrapping around the conductor and having a bottom portion in contactwith the alloy contact.
 10. The device of claim 8, wherein a top surfaceof the alloy contact is lower than a top surface of the epitaxystructure.
 11. The device of claim 8, wherein the DSL layer is incontact with the alloy contact.
 12. The device of claim 7, furthercomprising: a barrier layer in between the DSL layer and the conductor,wherein the barrier layer extends into the epitaxy structure at adifferent depth than the DSL layer.
 13. The device of claim 12, whereinthe DSL layer extends into the epitaxy structure deeper than the barrierlayer.
 14. A method, comprising: depositing a dielectric layer over asource/drain stressor; etching a contact hole that extends through thedielectric layer and into the source/drain stressor, wherein an oxide isformed on a surface of the source/drain stressor exposed by the contacthole after etching the contact hole; removing the oxide from the surfaceof the source/drain stressor; forming a dielectric spacer liner (DSL)layer on a sidewall of the contact hole; and filling the contact holewith a conductive material.
 15. The method of claim 14, wherein formingthe DSL layer comprising: deposition the DSL layer on the sidewall and abottom of the contact hole; and etching the DSL layer to remove aportion of the DSL layer from the bottom of the contact hole.
 16. Themethod of claim 15, wherein removing the oxide is performed prior todepositing the DSL layer.
 17. The method of claim 14, wherein formingthe DSL layer is performed such that the DSL layer is in contact withthe source/drain stressor.
 18. The method of claim 14, furthercomprising: depositing a metal containing material in the contact holeprior to filling the contact hole with the conductive material; andconverting a first portion of the metal containing material and aportion of the source/drain stressor into an alloy contact.
 19. Themethod of claim 18, further comprising: removing a second portion of themetal containing material that is not converted to the alloy contact byan etchant, wherein the etchant is blocked from getting through the DSLlayer when removing the second portion of the metal containing material.20. The method of claim 19, further comprising: depositing a barrierlayer on the sidewall and a bottom of the contact hole after removingthe second portion of the metal containing material.